| Andreas Aal Volkswagen Wolfsburg, Germany | „Podium discussion: Reliability of automotive electronics“ |
| Jörg Acker Brandenburg University of Technology Cottbus-Senftenberg | “Reliability and Recycling of Battery Materials” |
| Oliver Aubel GLOBALFOUNDRIES Dresden, Germany | „Podium discussion: Reliability of automotive electronics“ |
| Ingrid de Wolf IMEC Leuven, Belgium | „FinFETs: Sensing and feeling mechanical stress„ |
| André Clausner Fraunhofer IKTS Dresden, Germany | “Studying stress effects in transistor channels by nanoindentation with varied contact geometries”. |
| Reinhold Dauskardt Stanford University Palo Alto/CA, USA | “Hybrid Dielectric Films for Device Technologies: Understanding Relationships between Molecular Structure, Processing and Function” |
| Robert Filipek AGH Krakow Poland | “Tortuosity and Porosity in Electrochemical Systems – Computed Tomography Based 3D Transport Modelling” |
| Christoph Gammer ESI Leoben Austria | “Recent advances in nanoscale strain mapping using 4D STEM” |
| Kristina Kutukova deepXscan Dresden, Germany | “In-situ nano-XCT study of the local energy release rate for crack propagation in advanced ICs” |
| Karl Leo Technische Universität Dresden, Germany | “Organic semiconductors – from a lab curiosity to serious applications” |
| Sandrine Lhostis ST Microelectronics Crolles, France | “New reliability challenges for 3D integration stacking using hybrid bonding” |
| Rodrigo Martins Uninova Lisbon Portugal | “Eco-strategies for next generation electronics” |
| Daniel Nemecek TESCAN Brno, Czech Republic | “Advancing nanoscale characterization of semiconductor devices by effortless 4D-STEM workflows” |
| Hiroshi Nishikawa Osaka University Japan | “Solid-phase bonding process using nanostructured surface for power devices in automotive” |
| Iuliana Panchenko Technische Universität Dresden, Germany | „Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level„ |
| Matthias Stecher Infineon Technologies Munich, Germany | „Degradation mechanisms of 10kV-reinforced isolated gate drivers at high switching frequencies greater than 30kHz” |
| Vikas Tapan Siemens Munich, Germany | Early architectural exploration with PAVE360 |
| Olivier Thomas Aix Marseille Universite Marseille, France | Phase change materials for embedded memories: in situ investigation of crystallization behavior using synchrotron radiation” |
| Carl V. Thompson MIT Boston/NY, USA | “Contrasting Stress Evolution During Lithiation and Delithiation of Different Electrode Materials for Thin Film Batteries” |
| Lionel Vignoud CEA-LETI Grenoble, France | “Stress and strain control in microelectronic devices: How to optimize the steps from design to manufacturing?“ |
| Pal-Jen Wei Bruker Taiwan | „Indentation-induced delamination and adhesion work evaluation at elevated temperature in semicon industrial cases„ |
| Ehrenfried Zschech deepXscan Dresden, Germany | “Controlled microcrack steering into toughened regions – What microelectronics can learn from nature?” |
