Invited Speakers

Andreas Aal
Wolfsburg, Germany
„Podium discussion: Reliability of automotive electronics“
Oliver Aubel
Dresden, Germany
„Podium discussion: Reliability of automotive electronics“
Ingrid de Wolf
Leuven, Belgium
FinFETs: Sensing and feeling mechanical stress
Andre Clausner
Fraunhofer IKTS
Dresden, Germany
“Studying stress effects in transistor channels by nanoindentation with varied contact geometries”.
Reinhold Dauskardt
Stanford University
Palo Alto/CA, USA
“Hybrid Dielectric Films for Device Technologies: Understanding Relationships between Molecular Structure, Processing and Function”
Robert Filipek
AGH Krakow
“Tortuosity and Porosity in Electrochemical Systems –  Computed Tomography Based 3D Transport Modelling”
Christoph Gammer
University Leoben
“Recent advances in nanoscale strain mapping using 4D STEM”
Kristina Kutukova
Dresden, Germany
“In-situ nano-XCT study of the local energy release rate for crack propagation in advanced ICs”
Karl Leo
Technische Universität Dresden, Germany
“Organic semiconductors – from a lab curiosity to serious applications”
Sandrine Lhostis
ST Microelectronics
Crolles, France
“New reliability challenges for 3D integration stacking using hybrid bonding”
Rodrigo Martins
Uninova Lisbon
“Eco-strategies for next generation electronics”
Daniel Nemecek
Brno, Czech Republic
“Advancing nanoscale characterization of semiconductor devices by effortless 4D-STEM workflows”
Hiroshi Nishikawa
Osaka University
“Solid-phase bonding process using nanostructured surface for power devices in automotive”
Iuliana Panchenko
Technische Universität Dresden, Germany
Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level
Matthias Stecher
Infineon Technologies
Munich, Germany
„Degradation mechanisms of 10kV-reinforced isolated gate drivers at high switching frequencies greater than 30kHz”
Olivier Thomas
Aix Marseille Universite
Marseille, France
Phase change materials for embedded memories: in situ investigation of crystallization behavior using synchrotron radiation”
Carl V. Thompson
Boston/NY, USA
“Contrasting Stress Evolution During Lithiation and Delithiation of Different Electrode Materials for Thin Film Batteries”
Lionel Vignoud
Grenoble, France
“Stress and strain control in microelectronic devices: How to optimize the steps from design to manufacturing?“
Pal-Jen Wei
Indentation-induced delamination and adhesion work evaluation at elevated temperature in semicon industrial cases
Ehrenfried Zschech
Dresden, Germany
“Controlled microcrack steering into toughened regions – What microelectronics can learn from nature?”