Conference Programm
You can download the individual slides as pdf by clicking on the titles.
Monday 24th April 2023
| | Session 2: Impact of stress on device properties | Chair: Carl V. Thompson |
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| T4 | 11:00 | Kristina Kutukova, deepXscan, Dresden, Germany | In-situ nano-XCT study of the local energy release rate for crack propagation in advanced ICs |
| T5 | 11:30 | Pal Jen Wei, Bruker, Taiwan | Indentation-Induced Delamination and Adhesion Work Evaluation at Elevated Temperature in Semicon Industrial Cases |
| T6 | 12:00 | André Clausner, Fraunhofer IKTS, Dresden, Germany | Studying stress effects in transistor channels by nanoindentation with varied contact geometries |
| T7 | 12:30 | Reinhold Dauskardt, Stanford University, Palo Alto/CA, USA | Hybrid Dielectric Films for Device Technologies: Understanding Relationships between Molecular Structure, Processing and Function |
| | Session 3: Robustness of engineered systems: From design to application | Chair: Reinhold Dauskardt |
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| T8 | 14:30 | Vikas Tapan, Siemens, Munich, Germany | Early architectural exploration with PAVE360 |
| T9 | 15:00 | Hiroshi Nishikawa, Osaka University, Japan | Solid-phase bonding process using nanostructured surface for power devices in automotive |
| 15:30 | Chair: Kristina Kutukova | Poster session |
| | | |
| 17:00 | Moderators:
Andreas Aal, VOLKSWAGEN
Oliver Aubel, GLOBALFOUNDRIES | Podium discussion
„Reliability of automotive electronics“ |
| | Key Contributors:
Joe McPherson
Günter Haas (Entegris)
Tapan Vikas (SiemensEDA)
Nir Sever (proteanTecs) | Context:
Upcoming hardware challenges on the way towards the Software-defined-Vehicle |
Tuesday 25th April 2023
| | Session 4: Materials characterization for device development and reliability engineering | Chair: Christoph Gammer |
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| T10 | 09:00 | Iuliana Panchenko, Technical University Dresden, Germany | Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level |
| T11 | 09:30 | Olivier Thomas,
Aix Marseille University, France | Phase change materials for embedded memories: in situ investigation of crystalli-zation behavior using synchrotron radiation |
| T12 | 10:00 | Ehrenfried Zschech,
deepXscan, Dresden, German | Controlled microcrack steering into toughened regions – What microelectronics can learn from nature? |
| | Session 5: Degradation mechanisms and materials behaviour | Chair: Rodrigo Martins |
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| T13 | 11:00 | Matthias Stecher, Infineon Technologies, Munich, Germany | Degradation mechanisms of 10kV-reinforced isolated gate drivers at high switching frequencies greater than 30kHz |
| T14 | 11:30 | Carl V. Thompson, MIT, Boston/NY, USA | Contrasting Stress Evolution During Lithiation and Delithiation of Different Electrode Materials for Thin Film Batteries |
| T15 | 12:00 | Robert Filipek, AGH Krakow, Poland | Tortuosity and Porosity in Electrochemical Systems – Computed Tomography Based 3D Transport Modelling |
| T16 | 12:30 | Jörg Acker, Brandenburg University of Technology Cottbus-Senftenberg | Reliability and Recycling of Battery Materials |
| 14:00 | Hiking tour in Saxonian Switzerland |
| 17:30 | Chair: Kristina Kutukova | Poster session |
Wednesday 26th April 2023
Poster session
| Poster | Author | Title |
|---|
| P1 | Susann Rothe | A Proactive Design Approach to Avoid Migration-Induced Failure in IC Interconnects |
| P2 | Verena Hein | The Influence of the Interconnect Material on the Performance of a Highly Robust Metallization Layout |
| P3 | Stefan Weitz | Micromechanical in-situ studies of on-chip interconnect stack structures using X-ray microscopy |
| P4 | Michael Reisinger | Characterization of the thermo-mechanical behavior of Cu metallization in microelectronic applications |
| P5 | Tobias Ziegelwanger | Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing |
| P6 | André Lange | Investigating HCI and BTI degradation in 4H-SiC CMOS |
| P7 | Jolanta Janczak-Rusch | Nanomultilayers for thermal management and micro-/nano-joining |
| P8 | Bastian Rheingans | Thin-film transfer by nanopaste sinter-bonding |
| P9 | Bowen Zhang | In-situ TEM study and nanomechanical characterization of fracture behavior in two-dimensional covalent organic frameworks |
| P10 | Thomas Langner/ Jörg Acker | Shaping the topography of solar wafers due to increased reactivity of lattice strained silicon |
| P11 | Thomas Langner/ Jörg Acker | Deposition of copper in lithium‑ion batteries during the deep discharge process |
| P12 | Thomas Langner/ Jörg Acker | Degradation of Cathode Foils from Lithium-Ion Batteries in Humid Atmosphere |
