Conference Programm
Monday 24th April 2023
| Session 1: Reliability in micro- and nanoelectronics | Chair: Ehrenfried Zschech | ||
|---|---|---|---|
| 08:45 | Ehrenfried Zschech, Chair | Opening remarks | |
| T1 | 09:00 | Sandrine Lhostis, STMicroelectronics, France | New reliability challenges for 3D integration stacking using hybrid bonding |
| T2 | 09:30 | NN | tbd |
| T3 | 10:00 | Ingrid de Wolf, Vladimir Chairman, IMEC, Leuven, Belgium | FinFETs: Sensing and feeling mechanical stress |
| 10:30 – 11:00 | Break |
| Session 2: Impact of stress on device properties | Chair: Carl V. Thompson | ||
|---|---|---|---|
| T4 | 11:00 | Lionel Vignoud, CEA-LETI, Grenoble, France | Strains and stresses control in microelectronic devices: How to optimize the steps from design to manufacturing? |
| T5 | 11:30 | Daniel Nemecek, TESCAN, Brno, Czech Republic | Advancing nanoscale characterization of semiconductor devices by effortless 4D-STEM workflows |
| T6 | 12:00 | Christoph Gammer, University Leoben, Austria | Recent advances in nanoscale strain mapping using 4D STEM |
| T7 | 12:30 | Andre Clausner, Fraunhofer IKTS, Dresden, Germany | Studying stress effects in transistor channels by nanoindentation with varied contact geometries |
| 13:00 – 14:00 | Lunch Break |
| Session 3: Robustness of engineered systems: From design to application | Chair: Reinhold Dauskardt | ||
|---|---|---|---|
| T8 | 14:30 | Iuliana Panchenko, Technical University Dresden, Germany | Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level |
| T9 | 15:00 | Hiroshi Nishikawa, Osaka University, Japan | Solid-phase bonding process using nanostructured surface for power devices in automotive |
| 15:30 | Chari: tbd | Poster session | |
| 17:00 | Andreas Aal, VOLKSWAGEN, Oliver Aubel, GLOBALFOUNDRIES | Podium discussion „Reliability of automotive electronics“ |
| 19:00 | BBQ |
Tuesday 25th April 2023
| Session 4: Materials characterization for device development and reliability engineering | Chair: Christoph Gammer | ||
|---|---|---|---|
| T10 | 09:00 | NN, Tescan, Brno, Czech Republic | tbd |
| T11 | 09:30 | Olivier Thomas, Aix Marseille University, France | Phase change materials for embedded memories: in situ investigation of crystalli-zation behavior using synchrotron radiation |
| T12 | 10:00 | Ehrenfried Zschech, deepXscan, Dresden, German | Controlled microcrack steering into toughened regions – What microelectronics can learn from nature? |
| 10:30 – 11:00 | Break |
| Session 5: Degradation mechanisms and materials behaviour | Chair: Rodrigo Martins | ||
|---|---|---|---|
| T13 | 11:00 | Matthias Stecher, Infineon Technologies, Munich, Germany | Degradation mechanisms of 10kV-reinforced isolated gate drivers at high switching frequencies greater than 30kHz |
| T14 | 11:30 | NN | tbd |
| T15 | 12:00 | Carl V. Thompson, MIT, Boston/NY, USA | Contrasting Stress Evolution During Lithiation and Delithiation of Different Electrode Materials for Thin Film Batteries |
| T16 | 12:30 | Robert Filipek, AGH Krakow, Poland | Tortuosity and Porosity in Electrochemical Systems – Computed Tomography Based 3D Transport Modelling |
| 17:00 | Chair: tbd | Poster session |
| 13:00 – 14:00 | Lunch Break |
| 14:00 | Hiking tour in Saxonian Switzerland |
| 17:00 | Chair: tbd | Poster session |
| 20:00 | Conference DInner |
Wednesday 26th April 2023
| Session 6: Micro- and nanomechanics | Chair: Andre Clausner | ||
|---|---|---|---|
| T17 | 09:00 | Pal Jen Wei, Bruker, Taiwan | Indentation-Induced Delamination and Adhesion Work Evaluation at Elevated Temperature in Semicon Industrial Cases |
| T18 | 09:30 | Kristina Kutukova, deepXscan, Dresden, Germany | In-situ nano-XCT study of the local energy release rate for crack propagation in advanced Ics |
| T19 | 10:00 | Reinhold Dauskardt, Stanford University, Palo Alto/CA, USA | Hybrid Dielectric Films for Device Technologies: Understanding Relationships between Molecular Structure, Processing and Function |
| 10:30 – 11:00 | Break |
| Session 7: Reliability of organic electronics | Chair: Olivier Thomas | ||
|---|---|---|---|
| T20 | 11:00 | Rodrigo Martins, Uninova Lisbon, Portugal | Eco-Strategies for next generation electronics |
| T21 | 11:30 | NN, Heliatek, Dresden, Germany | tbd |
| T22 | 12:00 | Karl Leo, Technical University Dresden, Germany | Organic semiconductors – from a lab curiosity to serious applications |
| 12:30 | Ehrenfried Zschech | Closing remarks |
| 13:00 – 14:00 | Lunch Break |
Poster session
| Poster | Author | Title |
|---|---|---|
| P1 | Susann Rothe | A Proactive Design Approach to Avoid Migration-Induced Failure in IC Interconnects |
| P2 | André Lange | Investigating HCI and BTI degradation in 4H-SiC CMOS |
| P3 | Verena Hein | The Influence of the Interconnect Material on the Performance of a Highly Robust Metallization Layout |
| P4 | Bastian Rheingans | Thin-film transfer by nanopaste sinter-bonding |
| P5 | Stefan Weitz | Micromechanical in-situ studies of on-chip interconnect stack structures using X-ray microscopy |
| P6 | Bowen Zhang | In-situ TEM study and nanomechanical characterization of fracture behavior in two-dimensional covalent organic frameworks |
| P7 | Jolanta Janczak-Rusch | Nanomultilayers for thermal management and micro-/nano-joining |
| P8 | Thomas Langner/ Jörg Acker | Shaping the topography of solar wafers due to increased reactivity of lattice strained silicon |
| P9 | Thomas Langner/ Jörg Acker | Degradation of Cathode Foils from Lithium-Ion Batteries in Humid Atmosphere |
| P10 | Thomas Langner/ Jörg Acker | Deposition of copper in lithium‑ion batteries during the deep discharge process |