Conference Programm

You can download the individual slides as pdf by clicking on the titles.

Monday 24th April 2023

Session 1: Reliability in micro- and nanoelectronicsChair: Ehrenfried Zschech
08:45Ehrenfried Zschech, ChairOpening remarks
T109:00Sandrine Lhostis,
STMicroelectronics, France
New reliability challenges for 3D integration
stacking using hybrid bonding
T209:30Susann Rothe, Technical University DresdenCombined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines
T310:00Ingrid de Wolf, Vladimir Chairman, IMEC, Leuven, BelgiumFinFETs: Sensing and feeling mechanical stress
10:30 – 11:00Break
Session 2: Impact of stress on device propertiesChair: Carl V. Thompson
T411:00Kristina Kutukova, deepXscan, Dresden, GermanyIn-situ nano-XCT study of the local energy release rate for crack propagation in advanced ICs
T511:30Pal Jen Wei, Bruker, TaiwanIndentation-Induced Delamination and Adhesion Work Evaluation at Elevated Temperature in Semicon Industrial Cases
T612:00André Clausner, Fraunhofer IKTS, Dresden, GermanyStudying stress effects in transistor channels by nanoindentation with varied contact geometries
T712:30Reinhold Dauskardt, Stanford University, Palo Alto/CA, USAHybrid Dielectric Films for Device Technologies: Understanding Relationships between Molecular Structure, Processing and Function
13:00 – 14:30Lunch Break
Session 3: Robustness of engineered systems: From design to applicationChair: Reinhold Dauskardt
T814:30Vikas Tapan, Siemens, Munich, GermanyEarly architectural exploration with PAVE360
T915:00Hiroshi Nishikawa, Osaka University, JapanSolid-phase bonding process using nanostructured surface for power devices in automotive
15:30Chair: Kristina KutukovaPoster session
Podium discussion
„Reliability of automotive electronics“
Key Contributors:
Joe McPherson
Günter Haas (Entegris)
Tapan Vikas (SiemensEDA)
Nir Sever (proteanTecs)
Upcoming hardware challenges on the way towards the Software-defined-Vehicle

Tuesday 25th April 2023

Session 4: Materials characterization for device development and reliability engineeringChair: Christoph Gammer
T1009:00Iuliana Panchenko, Technical University Dresden, GermanyHybrid bond and nanowired bump technologies for high density interconnect formation on wafer level
T1109:30Olivier Thomas,
Aix Marseille University, France
Phase change materials for embedded memories: in situ investigation of crystalli-zation behavior using synchrotron radiation
T1210:00Ehrenfried Zschech,
deepXscan, Dresden, German
Controlled microcrack steering into toughened regions – What microelectronics can learn from nature?
10:30 – 11:00Break
Session 5: Degradation mechanisms and materials behaviourChair: Rodrigo Martins
T1311:00Matthias Stecher, Infineon Technologies, Munich, GermanyDegradation mechanisms of 10kV-reinforced isolated gate drivers at high switching frequencies greater than 30kHz
T1411:30Carl V. Thompson, MIT, Boston/NY, USAContrasting Stress Evolution During Lithiation and Delithiation of Different Electrode Materials for Thin Film Batteries
T1512:00Robert Filipek, AGH Krakow, PolandTortuosity and Porosity in Electrochemical Systems –  Computed Tomography Based 3D Transport Modelling
T1612:30Jörg Acker, Brandenburg University of Technology Cottbus-SenftenbergReliability and Recycling of Battery Materials
13:00 – 14:00Lunch Break
14:00Hiking tour in Saxonian Switzerland
17:30Chair: Kristina KutukovaPoster session
20:00Conference Dinner

Wednesday 26th April 2023

Session 6: Micro- and nanomechanicsChair:  André Clausner
T1709:00Lionel Vignoud, CEA-LETI, Grenoble, FranceStrains and stresses control in microelectronic devices: How to optimize the steps from design to manufacturing?
T1809:30Daniel Nemecek, TESCAN, Brno, Czech RepublicAdvancing nanoscale characterization of semiconductor devices by effortless 4D-STEM workflows
T1910:00Christoph Gammer,
ESI Leoben, Austria
Recent advances in nanoscale strain mapping using 4D STEM
10:30 – 11:00Break
Session 7: Reliability of organic electronicsChair: Olivier Thomas
T2011:00Rodrigo Martins, Uninova Lisbon, PortugalEco-Strategies for next generation electronics
T2111:30Wiebke Langgemach, Fraunhofer FEPProcessing flexible glass – thin film stress and its influence on glass durability
T2212:00Karl Leo, Technical University Dresden, GermanyOrganic semiconductors – from a lab curiosity to serious applications
12:30Ehrenfried ZschechClosing remarks
13:00 – 14:00Lunch Break

Poster session

P1Susann RotheA Proactive Design Approach to Avoid Migration-Induced Failure in IC Interconnects 
P2Verena HeinThe Influence of the Interconnect Material on the Performance of a Highly Robust Metallization Layout
P3Stefan WeitzMicromechanical in-situ studies of on-chip interconnect stack structures using X-ray microscopy
P4Michael ReisingerCharacterization of the thermo-mechanical behavior of Cu metallization in microelectronic applications
P5Tobias ZiegelwangerLocal gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing
P6André LangeInvestigating HCI and BTI degradation in 4H-SiC CMOS
P7Jolanta Janczak-RuschNanomultilayers for thermal management and micro-/nano-joining  
P8Bastian RheingansThin-film transfer by nanopaste sinter-bonding
P9Bowen ZhangIn-situ TEM study and nanomechanical characterization of fracture behavior in two-dimensional covalent organic frameworks
P10Thomas Langner/       Jörg Acker Shaping the topography of solar wafers due to increased reactivity of lattice strained silicon
P11Thomas Langner/     Jörg Acker Deposition of copper in lithium‑ion batteries during the deep discharge process
P12Thomas Langner/      Jörg Acker Degradation of Cathode Foils from Lithium-Ion Batteries in Humid Atmosphere