Accepted abstracts are published in the electronic conference booklet as submitted. You can donload the booklet right below.
All active participants are invited to submit a full paper of their contribution for a Special Issue “Reliability and Stress-Related Phenomena in Nanoelectronics” to the Springer “Journal of Electronic Materials”: https://www.springer.com/journal/11664. The deadline for manuscript submission will be end of October 2023.
The pdf files of the presentations of the invited speakers can be downloaded directly from the program.