Call for abstracts

Abstract Booklet

Accepted abstracts are published in the electronic conference booklet as submitted. You can donload the booklet right below.

Full Papers

All active participants are invited to submit a full paper of their contribution for a Special Issue “Reliability and Stress-Related Phenomena in Nanoelectronics” to the Springer “Journal of Electronic Materials”: The deadline for manuscript submission will be end of October 2023.

Conference Slides

The pdf files of the presentations of the invited speakers can be downloaded directly from the program.