17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
„Stress workshop“

The conference will cover the whole range from fundamental research to industrial applications. It will provide a forum for scientists and engineers from universities, research institutions and industry to discuss current challenges and future scenarios related to reliability and stress-induced phenomena in micro- and nanoelectronics.

Co-Chairs

  • Ehrenfried Zschech, deepXscan Dresden & Technische Universität Dresden, Germany
  • Reinhold Dauskardt, Stanford University, Palo Alto/CA, USA
  • Valeriy Sukharev, Mentor Graphics / Siemens EDA, Fremont/CA, USA
  • Olivier Thomas, Aix-Marseille Universite, France
  • Zhong Chen, NTU Singapore

Scientific Committee

  • Alex Dommann, EMPA, Switzerland
  • Martin Gall, GLOBALFOUNDRIES Malta/NY, USA
  • Chee Lip Gan, NTU Singapore
  • Goeran Jerke, Bosch Stuttgart, Germany
  • Junichi Koike, Tohoku University, Sendai, Japan
  • Jens Lienig, Technical University Dresden, Germany
  • Zhiyong Ma, Intel, Hillsboro/OR, USA
  • Jon Molina, IMDEA Materials, Madrid, Spain
  • Stephane Moreau, Leti Grenoble, France
  • Luu Nguyen, Psi Quantum, Palo Alto/CA, USA
  • Natalia Sobczak, IMIM PAN Cracow, Poland
  • Oden Warren, Bruker, Minneapolis/MN, USA
  • Ingrid de Wolf, IMEC Leuven, Belgium
  • Xiaopeng Xu, Synopsys, Mountain View/CA, USA

Organizing Committee

  • Dominik Gronarz, Organic Electronics Saxony, Dresden, Germany
  • Kim Brendel, Hotel Elbresidenz, Bad Schandau, Germany
  • Kristina Kutukova, deepXscan GmbH, Dresden, Germany
  • Johann Zeller, student, Dresden, Germany

Sponsors

Organizers