17th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
„Stress workshop“

IRSP 2023 in Bad Schandau near Dresden was another successful conference in the series of Stress Workshops. We had 55 participants from Europe, US and Asia, 22 invited talks and 12 contributing posters, and a podium discussion “Reliability of Automotive Electronics”. A valuable asset of the workshop-like conference was that participants from academia, from semi industry and from equipment suppliers (mainly for characterization) attended the conference, and that we had much time for discussions.

Thanks for attending the conference. The next conference in this series, 18th IRSP, will be held in Asia in Fall 2024.

Abstract Booklet
Program

Co-Chairs

  • Ehrenfried Zschech, deepXscan Dresden & Technische Universität Dresden, Germany
  • Reinhold Dauskardt, Stanford University, Palo Alto/CA, USA
  • Valeriy Sukharev, Mentor Graphics / Siemens EDA, Fremont/CA, USA
  • Olivier Thomas, Aix-Marseille Universite, France
  • Zhong Chen, NTU Singapore

Scientific Committee

  • Alex Dommann, EMPA, Switzerland
  • Martin Gall, GLOBALFOUNDRIES Malta/NY, USA
  • Chee Lip Gan, NTU Singapore
  • Goeran Jerke, Bosch Stuttgart, Germany
  • Junichi Koike, Tohoku University, Sendai, Japan
  • Jens Lienig, Technical University Dresden, Germany
  • Zhiyong Ma, Intel, Hillsboro/OR, USA
  • Jon Molina, IMDEA Materials, Madrid, Spain
  • Stephane Moreau, Leti Grenoble, France
  • Luu Nguyen, Psi Quantum, Palo Alto/CA, USA
  • Natalia Sobczak, IMIM PAN Cracow, Poland
  • Oden Warren, Bruker, Minneapolis/MN, USA
  • Ingrid de Wolf, IMEC Leuven, Belgium
  • Xiaopeng Xu, Synopsys, Mountain View/CA, USA

Organizing Committee

  • Dominik Gronarz, Organic Electronics Saxony, Dresden, Germany
  • Kim Brendel, Hotel Elbresidenz, Bad Schandau, Germany
  • Kristina Kutukova, deepXscan GmbH, Dresden, Germany
  • Johann Zeller, student, Dresden, Germany

Sponsors

Organizers